发明名称 Method of forming self-aligned poly for embedded flash
摘要 A method of manufacturing a microelectronic device including, in one embodiment, providing a substrate having a plurality of partially completed microelectronic devices including at least one partially completed memory device and at least one partially completed transistor. At least a portion of the partially completed transistor is protected by forming a first layer over the portion of the partially completed transistor to be protected during a subsequent material removal step. A second layer is formed substantially covering the partially completed memory device and the partially completed transistor. Portions of the second layer are removed leaving a portion of the second layer over the partially completed memory device. At least a substantial portion of the first layer is removed from the partially completed transistor after the portions of the second layer are removed.
申请公布号 US7153744(B2) 申请公布日期 2006.12.26
申请号 US20040822505 申请日期 2004.04.12
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHEN HAN-PING;YU CHUNG-YI
分类号 H01L21/336;H01L21/8247;H01L27/115;H01L27/12;H01L29/423;H01L29/76;H01L29/788 主分类号 H01L21/336
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