Centering mechanism, centering unit, semiconductor manufacturing apparatus, and centering method

摘要

A centering unit comprises a plate, centering mechanism, link mechanism, and cylinder mechanism. The plate vertically divides the interior of a frame. The support table is located substantially on the center of the plate. The centering mechanism can center each wafer on the support table. Centering plates of the centering mechanism are located on either side of the support table and have engaging surfaces and that extend along the outer peripheral surface of the wafer. The link mechanism and the cylinder mechanism serve to extend and contract the space between the centering plates.