发明名称 Methods of forming capacitors and methods of forming capacitor dielectric layers
摘要 A method of forming a capacitor includes forming first capacitor electrode material over a semiconductor substrate. A silicon nitride comprising layer is formed over the first capacitor electrode material. The semiconductor substrate with silicon nitride comprising layer is provided within a chamber. An oxygen comprising plasma is generated remote from the chamber. The remote plasma generated oxygen is fed to the semiconductor substrate within the chamber at a substrate temperature of no greater than 750° C. effective to form a silicon oxide comprising layer over the silicon nitride comprising layer. After the feeding, a second capacitor electrode material is formed over the silicon oxide comprising layer. Methods of forming capacitor dielectric layers are also disclosed.
申请公布号 US7153736(B2) 申请公布日期 2006.12.26
申请号 US20040779244 申请日期 2004.02.13
申请人 MICRON TECHNOLOGY, INC. 发明人 EPPICH DENISE M.;BEAMAN KEVIN L.
分类号 H01L21/8242;H01L27/04;H01L21/02;H01L21/3105;H01L21/314;H01L21/318;H01L21/822;H01L27/108 主分类号 H01L21/8242
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