发明名称 |
Laser diode module, laser apparatus and laser processing apparatus |
摘要 |
Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.
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申请公布号 |
US7154926(B2) |
申请公布日期 |
2006.12.26 |
申请号 |
US20040942809 |
申请日期 |
2004.09.17 |
申请人 |
LASERFRONT TECHNOLOGIES, INC. |
发明人 |
KOUTA HIKARU;TAKAHASHI HISAYA;ONO HIDEYUKI;IKEDA YUUZOU;TUNEKANE MASAKI;ISHIDA TOSHINORI;KUBOTA KEIICHI |
分类号 |
H01S3/00;H01S5/022;H01S5/02;H01S5/024;H01S5/40 |
主分类号 |
H01S3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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