| 摘要 |
A temperature tracking attenuator includes a substrate having a circuit chip with electrical connections providing a thermal interface with adjacent circuitry providing an attenuator component package. The package comprises a thermal layer on one side which is adhesively joined to the underside of an insulative layer with the exposed side of the insulative layer having an output connector, an input connector, and a circuit ground connector. A pocket in the layers receives an attenuator chip that includes an input tab, an output tab and a ground tab, which are indexed and registered with the input connector, the output connector and the circuit ground connector. A spring pressure clip, which constitutes ground, is pressed over the edge of the package where one leg of the clip engages with the circuit ground connector and the other leg of the clip connects to the underside of the thermal layer.
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