发明名称 Process for decreasing the resistivity of conductive flow field plates for use in fuel cells
摘要 The present invention provides a process for decreasing the resistivity of a non-machined conductive flow field plate for use in a fuel cell. The process includes the step of annealing the conductive flow field plate by heating the conductive flow field plate to a temperature between 25° C. (room temperature) and a temperature slightly lower than the material softening temperature of the material composition of the conductive flow field plate; maintaining the conductive flow field plate at that temperature for an effective period of time; and, cooling the conductive flow field plate to room temperature.
申请公布号 US7153603(B2) 申请公布日期 2006.12.26
申请号 US20030390122 申请日期 2003.03.17
申请人 E. I. DUPONT CANADA COMPANY 发明人 CAI YUQI;CHOPRA DIVYA;FISHER JOHN C.
分类号 H01M8/02;B29C43/02;B29C71/02;C08K7/06;H01B1/24 主分类号 H01M8/02
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