发明名称 |
Process for decreasing the resistivity of conductive flow field plates for use in fuel cells |
摘要 |
The present invention provides a process for decreasing the resistivity of a non-machined conductive flow field plate for use in a fuel cell. The process includes the step of annealing the conductive flow field plate by heating the conductive flow field plate to a temperature between 25° C. (room temperature) and a temperature slightly lower than the material softening temperature of the material composition of the conductive flow field plate; maintaining the conductive flow field plate at that temperature for an effective period of time; and, cooling the conductive flow field plate to room temperature.
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申请公布号 |
US7153603(B2) |
申请公布日期 |
2006.12.26 |
申请号 |
US20030390122 |
申请日期 |
2003.03.17 |
申请人 |
E. I. DUPONT CANADA COMPANY |
发明人 |
CAI YUQI;CHOPRA DIVYA;FISHER JOHN C. |
分类号 |
H01M8/02;B29C43/02;B29C71/02;C08K7/06;H01B1/24 |
主分类号 |
H01M8/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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