Pattern-forming process using photosensitive resin composition

摘要

There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): wherein R¹ represents and R² represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.