| 摘要 |
A piezoelectric oscillator capable of being downsized by reducing a plane size. In a laminate lead frame (50) comprising two lead frames (30, 40), a lead (32) for connection with a piezoelectric oscillation element (10) is formed on an upside lead frame (30), the lead (32) is raised upward to form a connection terminal (36), a lead (42) for mounting to a mounting substrate is formed on a downside lead frame (40), the lead (42) is raised downward to form a mounting terminal (46), and an IC (60) formed with an oscillation circuit is mounted on the laminate lead frame (50). The piezoelectric oscillation element (10) having a piezoelectric oscillation piece (12) enclosed within a package (20) is mounted on the laminate lead frame (50), and the laminate lead frame (50) and the piezoelectric oscillation element (10) are enclosed within a resin package with the main surface of the mounting terminal (46) exposed to form a piezoelectric oscillator. |
