发明名称 Method for imaging wafers using a projection mask aligner
摘要 A method uses a projection mask aligner that includes a hard pellicle mounting apparatus having an enclosure with an interior cavity, an inlet port for receiving a mask with a protective cover, and an outlet port for outputting a mask covered by a hard pellicle, that has a demounting portion for removing the protective cover from the mask, that has a mounting portion for mounting the hard pellicle on the mask, and that has a conduit for receiving a light-transmitting gas. The method includes: forming a hard pellicle/mask assembly having at least one hard pellicle mounted thereon; positioning the hard pellicle/mask assembly between a light source and an imaging lens; positioning a photoresist-coated semiconductor wafer under the imaging lens with a photoresist layer facing the lens; and imaging microelectronics circuits from the hard pellicle/mask assembly onto the semiconductor wafer.
申请公布号 US7151593(B2) 申请公布日期 2006.12.19
申请号 US20060412555 申请日期 2006.04.27
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN BURN JENG
分类号 G03B27/32;G03B27/62;G03C5/00;G03F1/00;G03F1/14;G03F7/20 主分类号 G03B27/32
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