发明名称 CLEANER APPARATUS OF CHEMICAL AND MECHANICAL POLISHING SYSTEM
摘要 A cleaner apparatus of a CMP equipment is provided to perform exactly and rapidly the replacement work by connecting a finger to a spindle finger using a single finger fixation screw. A cleaner apparatus comprises a cleaning part for cleaning a wafer, and a spin part for rinsing and drying the cleaned wafer. The spin part further includes a spindle finger(60) for mounting the wafer, a plurality of fingers(70) connected to the spindle finger, and a plurality of finger fixation screws(80) corresponding to the fingers. The finger fixation screws connect the fingers to the spindle finger.
申请公布号 KR20060130301(A) 申请公布日期 2006.12.19
申请号 KR20050050902 申请日期 2005.06.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, HYUN JIN
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
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