发明名称 |
Integrated circuit die having an interference shield |
摘要 |
A package for housing a device (e.g., an integrated circuit chip or die) includes a Faraday cage. The Faraday cage is at least partially formed in the integrated circuit die. The die includes conductive vias and solder balls surrounding a circuit. The package can be a ball grid array (BGA) package or flip chip package. The package substrate can include a ground plane.
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申请公布号 |
US7151011(B2) |
申请公布日期 |
2006.12.19 |
申请号 |
US20020243487 |
申请日期 |
2002.09.13 |
申请人 |
INSILICA, INC. |
发明人 |
SRIDHARAN GURUSWAMI M.;SRIDHARAN KARTIK M. |
分类号 |
H01L21/56;H01L23/12;H01L23/498;H01L23/522;H01L23/552;H01L23/58;H01L23/60 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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