| 摘要 |
A platen structure in a double side lapping apparatus for a silicon wafer is provided to restrain scratches from being generated on the wafer by processing a corner portion of a platen groove. A double side lapping apparatus for silicon wafer includes an upper platen and a lower platen under the upper platen. The lower platen has a platen groove(51). The platen groove is used for exhausting predetermined compounds from a surface of the lower platen. An upper corner(53) of the lower platen is chamfered. The upper corner of the lower platen is capable of being rounded. A stepped portion is capable of being formed at the upper corner of the lower platen.
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