发明名称 LASER PROCESSING METHOD AND DEVICE
摘要 <p>Displacement of a laser beam concentration point at an end of an object to be processed is reduced as much as possible, and simultaneously, laser processing is efficiently performed. A laser processing method has displacement acquiring steps (S06-S07) and position setting steps (S08-S09). In the displacement acquiring steps (S06-S07), a second laser beam for measuring the displacement of a main surface of an object to be processed is collected by a lens and irradiated, and the displacement between one point on a planned cutting line of the object and one end is acquired while the beam reflected by the main surface in correspondence with the irradiation is being detected. In the position setting steps (S08-S09), an initial position at which the lens is held relative to the main surface of the object based on the acquired displacement is set and the lens is held at the set initial position. With the lens held at the initial position, a first laser beam for processing is irradiated to form a reformed region at the one end of the planned cutting line, and then, with the lens released from the held state and while the position of the lens being adjusted, a reformed region is formed.</p>
申请公布号 KR20060130650(A) 申请公布日期 2006.12.19
申请号 KR20067016008 申请日期 2004.12.13
申请人 HAMAMATSU PHOTONICS K.K. 发明人 ATSUMI KAZUHIRO;KUNO KOJI;KUSUNOKI MASAYOSHI;SUZUKI TATSUYA
分类号 B23K26/04;B23K26/00;B23K26/02;B23K26/03;B23K26/38;B23K26/40;B23K101/40;H01L21/301 主分类号 B23K26/04
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