| 摘要 |
A vertical diffusion furnace in a semiconductor device fabrication is provided to prevent the damage of a temperature sensor and to restrain the failure of processing by installing the temperature sensor in a cap heater. A vertical diffusion furnace comprises a cylinder type flange(120), a tube(110) on the flange, a support plate(130) under the flange, a boat(140) for loading a plurality of wafers on the support plate, a cap heater, and a temperature sensor. The cap heater(150) is installed at a predetermined portion between the boat and the support plate. The cap heat includes a heat generating part. The temperature sensor(160) is installed in the cap heater.
|
