SPUTTERING APPARATUS

摘要

A sputtering apparatus that can minimize a gap between the mask and the carrier by respectively moving floating masks formed at four sides of a mask in the carrier direction after completing vertical conveyance of a carrier, and a sputtering apparatus that can minimize a gap between the mask and the carrier relative to each of the carriers by grasping bending degrees of carriers in advance, thereby automatically controlling moving amounts of the respective carriers are provided. A sputtering apparatus comprises a substrate part having a substrate on which deposition is carried out within a process chamber, a target part having a target(330) as a deposition material to be deposited onto the substrate, and a mask part having a mask(342) for masking the substrate such that deposition is performed on a specific portion of the substrate, wherein the mask part comprises: a mask(342); floating masks(344) formed at four sides including upper, lower, left and right sides of the mask and moved to the substrate part; a floating mask moving means(346) for moving the floating masks. The substrate part comprises a carrier(320) for supporting the substrate and transferring the substrate into the process chamber.