| 摘要 |
An assembly module of miniaturized parts is provided to reduce a dimension of a parts module by forming a cavity on a circuit board and mounting parts having relatively higher height on the cavity. In an assembly module of miniaturized parts, at least one cavity(110) is formed on a circuit board(100). A mounted part unit(200) consists of a cavity loaded part(210) which is mounted on the cavity(110) and base side mounted parts(220,230) which are mounted on a base side of the circuit board(100) where the cavity(110) is not formed.
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