| 摘要 |
A semiconductor device includes a semiconductor chip that generates heat in operation, a pair of heat sinks for cooling the chip, and a mold resin, in which the chip and the heat sinks are embedded. The thickness t 1 of the chip and the thickness t 2 of one of heat sinks that is joined to the chip using a solder satisfy the equation of t 2 /t 1 >=5. Furthermore, the thermal expansion coefficient alpha 1 of the heat sinks and the thermal expansion coefficient alpha 2 of the mold resin satisfy the equation of 0.5<=alpha 2/alpha1 <=1.5. In addition, the surface of the chip that faces the solder has a roughness Ra that satisfies the equation of Ra<=500 nm. Moreover, the solder is a Sn-based solder to suppress relaxation of a compressive stress in the chip, which is caused by the creeping of the solder. |
