Fremgangsmåde til at forbinde mikrostrukturerede komponentlag, som er egnede til at fremstille mikrostrukturerede komponenter og mikrostrukturerede komponenter

摘要

Process for connecting microstructured component layers made from metals and metal alloys comprises: (a) applying a multifunctional barrier layer on the joining surfaces of the component layers; (b) applying a solder layer on the barrier layer; (c) stacking the component layers; and (d) soldering under the action of heat. An Independent claim is also included for a microstructured component comprising a stack of microstructured component layers having a barrier layer and solder layer between them.