| 摘要 |
<p>A polishing pad having a groove pattern for used in a CMP apparatus is provided to improve polishing uniformity and pad lifetime and to distribute a slurry over the pad by employing a wide deep groove. A polishing apparatus(20) includes a lower machine base(22) having a table upper portion(23) and an outer cover. The table upper portion supports a group of polishing stations(25a,25b,25c) and a conveying station(27). The polishing stations include rotatable platens(30) where a polishing pad(100) is located. The polishing stations includes pad conditioner apparatuses(40). The pad conditioner apparatuses have rotatable conditioner heads(44) and rotatable arms(42) for holding a cleaning bucket. A slurry(50) is supplied on a surface of the polishing pad by a coupled slurry/rinse arm(52). Two or more halfway cleaning stations(55a,55b) are arranged between the neighboring polishing stations.</p> |
