| 摘要 |
A method and apparatus for electrolessly depositing a multilayer film using a processing solution(s) to clean and then electrolessly deposit a metal film having discrete or varying composition onto a conductive surface using a single processing cell. The process includes an in-situ cleaning step to minimize the formation of oxides on the conductive surfaces, by minimizing or preventing the exposure of the conductive surfaces to oxygen between the cleaning and electroless deposition process steps. In one aspect, the chemical components used in the processing solution(s) are selected so that the interaction of various chemical components will not drastically change the desirable properties of each of the interacting fluids. The continuous electroless deposition process may be used to form a first layer containing at least two of the following elements cobalt, tungsten, phosphorus or boron; and a second layer contains at least two of the following elements cobalt, boron or phosphorus. |
