AXIAL LEAD TYPE ELECTRIC PART AND CIRCUIT BOARD DEVICE MOUNTING THE SAME THEREOF

摘要

PROBLEM TO BE SOLVED: To prevent solder or tin applied to both terminals from flowing in the approaching direction even if it is heated above the melting point of solder by providing an extra metal layer for preventing solder or tin from flowing on the inner circumferential surface at the tubular part of a metal cap in an electronic part. SOLUTION: Terminals 11 formed at the opposite ends of a chip ceramic electronic part element, i.e., a chip capacitor 1, are fitted to the tubular part of a metal cap. A plated layer 12 of solder or tin is applied to the surface of the terminal 11 so that the chip capacitor 1 can be soldered easily to a substrate when the chip capacitor 1 is mounted thereon as it is. An extra metal layer 23 is provided on the inner circumferential surface at the tubular part 22 of the metal cap 2. The extra metal layer 23 is formed by applying solder or tin onto the inner circumferential surface at the tubular part 22. The solder or tin for forming the extra metal layer 23 preferably has a melting point lower than that of a metal forming the plating layer 12.