| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a tool and method for measuring thickness of a component for an electronic component mounting apparatus where the thickness of the component is measured automatically by simple constitution with various kinds of the electronic component mounting apparatuses as objects. <P>SOLUTION: In the electronic component mounting apparatus where an electronic component is taken out from a component feeder 4 in which a plurality of the component feeders 5 are arrayed with a loading head and mounted on a substrate, a component thickness measurement tool 25 is mounted to an arraying base 21 of the component feeder in parallel to the tape feeder 5. The component thickness measurement tool 25 is provided with a detection sensor 26 for obtaining information for measuring the thickness of the electronic component by accessing the loading head holding the electronic component to a tool body 25a which can be mounted in a mode having compatibility with the tape feeder 5. Thus, the thickness of the component is measured automatically by simple constitution with various kinds of the electronic component mounting apparatuses as objects. <P>COPYRIGHT: (C)2007,JPO&INPIT |
