| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning device capable of improving removing precision of dust or resist at an edge without being affected by the shape of the edge of a wafer. SOLUTION: The washing device comprises a stage 20 which rotates a plate-like wafer 10 in circumferential direction; a measuring part 50 for measuring at least either the shape of the edge of the wafer 10 or wettability of the edge of the wafer 10; a control unit 60 which classifies at least either the measured shape or wettability and, with the classification result as a judging reference, determines rotational speed for rotating the wafer 10 in the circumferential direction as well as the supplied amount of a cleaning liquid; and a cleaning liquid supply 40 which supplies the cleaning liquid to a rear surface 14 of the wafer 10, based on the supply amount. COPYRIGHT: (C)2007,JPO&INPIT
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