| 摘要 |
PROBLEM TO BE SOLVED: To provide a pre-applied sealing resin composition which is improved in that, when the resin composition is applied to a wafer and brought into the B-stage, the resin is prevented from becoming brittle, thereby preventing the damage of the resin composition during dicing. SOLUTION: The pre-applied sealing resin composition comprises (A) an epoxy resin which is liquid at 25°C and contains two or more epoxy groups in a molecule, (B) an epoxy resin which is solid at 25°C and contains two or more epoxy groups in a molecule, and (C) a curing agent having flux activity. COPYRIGHT: (C)2007,JPO&INPIT |
