| 摘要 |
A Manufacturing method for a semiconductor device is provided and includes examining a semiconductor element on a semiconductor wafer, by an on-wafer test, storing on-semiconductor-wafer coordinate position data of the semiconductor devices and a result of the on-wafer test, and incorporating the semiconductor element, divided as individual pieces by dicing the semiconductor wafer, in packages followed by conducting a final test. When the semiconductor element is incorporated in the package, generated and stored is association data of the on-semiconductor-wafer coordinate position data with a mark on the package. Determined is the wafer test result of the semiconductor element in the package by referring the association data based on the mark of the package when conducting the final test. Skipped to perform is a test item, in which the result of the on-wafer test can be utilized, among test items to perform in the final test.
|
