发明名称 Method for treating vapor deposition apparatus, method for depositing thin film, vapor deposition apparatus and computer program product for achieving thereof
摘要 A method for treating a vapor deposition apparatus, a method for depositing a thin film, a vapor deposition apparatus and a computer program product are disclosed for providing a reduced cleaning frequency. Accumulated material is deposited on an interior wall of a chamber of a vapor deposition unit during deposition of a thin film. While the deposition of the thin film is repeated, a gas is emitted from the accumulated material to deteriorate an uniformity in the film thickness of the thin film. The method involves depositing an amorphous film to cover the accumulated material before any influence of the accumulated material deposited on the interior wall of the chamber on the thickness of the thin film is evident. Gas emission from the accumulated material can be prevented by covering the accumulated material with the amorphous film. This configuration provides a thin film having an improved uniformity of thickness.
申请公布号 US2006280868(A1) 申请公布日期 2006.12.14
申请号 US20060452247 申请日期 2006.06.14
申请人 NEC ELECTRONICS CORPORATION 发明人 KATO YOSHITAKE;IWATA TERUO
分类号 C23C16/00;B05C11/00;C23C16/44;G06F19/00;H01L21/316 主分类号 C23C16/00
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