| 摘要 |
A processing apparatus and a processing method are provided to achieve improved throughput by starting a polishing process immediately after ending of a semiconductor wafer grinding process. A processing apparatus(1) comprises a chuck table, a polishing unit(5) and a polishing pad cleaning unit. The chuck table supports an object to be processed. The polishing unit includes a polishing pad(5b) having a diameter larger than that of the object to be processed, and a process liquid supply unit(8) for selectively supplying a polishing liquid and a washing liquid. The polishing unit polishes the object by permitting the polishing pad to contact the object on the chuck table from above. The polishing pad cleaning unit is arranged in the vicinity of the chuck table, and cleans a surface of the polishing pad from beneath. The polishing unit chemically and mechanically polishes the object while supplying a polishing liquid to the surface of the object supported on the chuck table. The polishing pad cleaning unit cleans the surface of the polishing pad while moving relatively to the polishing pad in a diameter direction of the polishing pad. |
