| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide electronic equipment that prevents short-circuits between electrode patterns during heating and sealing resin cracks, and its manufacturing method in terms of electronic equipment having a structure for mounting components on a substrate by soldering and its manufacturing method. <P>SOLUTION: This electronic equipment comprises a substrate 23 having two foot patterns 24A and 24B and one solder resist 25 with the foot patterns 24A and 24B exposed from the opening of the solder resist 25, mount components 20A and 20B to be mounted on the substrate 23 by solder 26, and a sealing resin 29 formed on the substrate 23 for sealing the mount components 20A and 20B. This equipment also piles a part (piles 26A and 26B) of the solder 26 on the top of the solder resist 25 under the mount component 20A and 20B. <P>COPYRIGHT: (C)2007,JPO&INPIT |
