| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin film magnetic induction element having high reliability by preventing forming of a cavity in a member (e.g., a plating film or an under filling) in a through-hole formed in a ferrite substrate; and a manufacturing method thereof. <P>SOLUTION: In the thin film magnetic induction element, through-holes 2a, 3a formed in a ferrite substrate 1 is formed by connecting holes 2b, 3b formed on a first main surface with holes 2c, 3c formed on a second main surface. On a plating seed layer 12 disposed on the ferrite substrate 1, terminal electrodes 6a, 6b and a connecting conductor 2, and coil conductors 4, 5 and a connecting conductor 3, are disposed, and the holes 2c, 3c are filled with an insulating film 16. By causing depth T1, T3 of the holes 2b, 3b to be less than depth T2, T4 of the holes 2c, 3c, and by causing inclinations S1, S3 of the side wall of the holes 2b, 3b to be less than an inclinations S2, S4 of the side wall of the holes 2c, 3c, the through-holes 2a, 3a can be filled with an under filling (not shown) without the forming of a cavity, so that a high reliability of the thin film magnetic induction element can be secured. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
