| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing tablet and its manufacturing method, and a semiconductor device using the semiconductor sealing tablet, capable of more reducing the formation of voids even in a semiconductor sealing tablet with the same high density. SOLUTION: When a powdered semiconductor sealing material is pressurized and tableted along one axis from two directions, a movement distance of one pressurizing surface is set to fall within a range of 85 to 100% of that of the other pressurizing surface. By pressurizing the tablet such that the ratio of the density of the whole tablet to true specific gravity is 93% or more, there is obtained the semiconductor sealing tablet in which differences of ratios of densities of three divided pieces obtained by dividing the tablet into three perpendicularly to the direction of the pressurization with respect to true specific gravity falls within 3%. COPYRIGHT: (C)2007,JPO&INPIT
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