| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency inductor element which can be manufactured by a simpler manufacturing step and at lower cost than heretofore, and which uses one substrate and has low loss and high inductance. SOLUTION: In the high-frequency inductor element shown by Fig.1, a grounding conductor 11 is formed on the inside surface of a recess 101 that is formed at the center of a silicon substrate 1, and the recess 101 is filled with a sacrifice layer 12 that is removed later (Fig.3). Then a winding line conductor 13 is formed at the center of the sacrifice layer 12, and an insulating supporting film 14 is formed so as to cover an opening surface of the recess 101. A winding line conductor 16 is formed at the center of the dielectric supporting film 14, and one end of the winding line conductor 13 and one end of the winding line conductor 16 are connected by a through hole 15, while the other end of the winding line conductor 13 is connected to a connection terminal conductor 20 and the other end of the winding line conductor 16 is connected to a connection terminal conductor 19. COPYRIGHT: (C)2007,JPO&INPIT
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