发明名称 METHOD OF MANUFACTURING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To manufacture a flexible wiring board while a cost required for production facilities is suppressed. SOLUTION: An insulating substrate 2 is fixed to a fixing jig 1 so that the surface of copper foil 3 may be exposed, and while the insulating substrate 2 is still fixed to the fixing jig 1, the copper foil 3 is etched using resist patterns 4a, 4b and 4c as masks, thus forming wiring patterns 3a, 3b and 3c on the insulating substrate 2. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006339190(A) 申请公布日期 2006.12.14
申请号 JP20050158523 申请日期 2005.05.31
申请人 SEIKO EPSON CORP 发明人 UENO HIROSHI
分类号 H05K3/06;H05K3/24;H05K3/28 主分类号 H05K3/06
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