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发明名称
METHOD FOR PARTIALLY SOLDERING OF PRINTED CIRCUIT BOARD
摘要
申请公布号
KR100657217(B1)
申请公布日期
2006.12.14
申请号
KR20050042297
申请日期
2005.05.20
申请人
发明人
分类号
B23K1/08
主分类号
B23K1/08
代理机构
代理人
主权项
地址
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