| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing optical semiconductors, excellent in solder reflow resistance, moisture resistance and moldability without impairing transparency when sealing a semiconductor substrate. <P>SOLUTION: The epoxy resin composition for optical semiconductors comprises (A) a bisphenol type liquid epoxy resin, (B) a liquid acid anhydride as a curing agent, (C) a carboxylic acid-terminated polyester solid resin and (D) a curing accelerator as essential components. <P>COPYRIGHT: (C)2007,JPO&INPIT |
