发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board having reliability by a simple manufacturing method. <P>SOLUTION: The wiring board 10 is comprised of a flexible part 14 and a rigid part 15 that is formed continuously to the flexible part 14. The flexible part 14 comprises a flexible board, wherein a wiring pattern 13 is stacked with an insulating resin layer 12 in-between, and the rigid part 15 is comprised of a flexible board made integrally with the flexible part 14, and the wiring density of the wiring pattern formed on the flexible board is set to be higher than that of the flexible part 14, resulting in permitting higher hardness for the wiring pattern than that of the flexible part 14. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006339186(A) 申请公布日期 2006.12.14
申请号 JP20050158456 申请日期 2005.05.31
申请人 SHINKO ELECTRIC IND CO LTD 发明人 KYOZUKA MASAHIRO;TAKENOUCHI TAKAHIRO;WATANABE SHOJI
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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