发明名称 ELECTRONIC DEVICE, SUBSTRATE CONNECTING METHOD, AND MULTI-LAYER FLEXIBLE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate connecting method which is used on an electronic device where circuit substrates located in opening/closing cases, connected relatively, rotatively each other, are connected with a multi-flexible wiring cable winding around a rotating axis, which inhibits looseness and fold from producing on the multi-layer flexible wiring cable and prevents a disconnection etc. of the multi-layer flexible wiring cable involved in opening/closing of the case; and to provide a multi-layer flexible substrate. SOLUTION: The multi-layer flexible wiring cable 12 connected to one circuit substrate is reversely folded so as to extend toward another circuit substrate, and is wound so that the cable layer positioned outside the folded portion is positioned on the inside circumference. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006339510(A) 申请公布日期 2006.12.14
申请号 JP20050164158 申请日期 2005.06.03
申请人 TOSHIBA CORP 发明人 MURAYAMA TAKUYA;UTENA HIROYUKI;KOIKE TORU
分类号 H05K1/02 主分类号 H05K1/02
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