| 摘要 |
An apparatus for manufacturing a semiconductor device includes an upper mold ( 21 ), a lower mold ( 22 ), and a plate ( 30, 130, 230 ) that includes at least one cavity ( 31 ) that receives resin and defines an outer shape and a thickness of a resin sealing portion, and a gate ( 32 ) through which the resin is guided to the cavity ( 31 ), the plate ( 30 ) being interposed between the upper mold ( 21 ) and the lower mold ( 22 ). The plate ( 130 ) further includes a resin film ( 132 ) fixed by viscoelastic or adhesive bonding to a side of thin plates ( 131 ) towards a substrate on which electrodes are provided. The semiconductor device is provided which has no resin burrs that occur on a substrate in an end portion of the molded body. The plate ( 30, 130, 230 ) is formed by multiple thin plates ( 231, 232, 233 ) joined by welding or positioned by positioning pins ( 237, 238 ). |
