| 摘要 |
<p>A method for aligning a wafer is provided to automatically preventing a temporary stop of a process by aligning the wafer using another alignment pattern. An alignment program is loaded in an exposure device(S100). A wafer is loaded on the exposure device(S200). A stage of the exposure device is moved to a first alignment pattern position of a wafer(S300). The exposure device aligns the wafer using a first alignment pattern(S400). When the exposure device does not sense a position or signal of the first alignment pattern, it fails an alignment of the wafer(S500). The exposure device moves a stage of the exposure device to a second alignment pattern position(S600). The wafer is aligned using a second alignment pattern(S700). It is judged whether or not the alignment of the wafer is succeeded(S800). When the alignment of the wafer is succeeded, the exposure device exposes the wafer(S900).</p> |
