MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD, MANUFACTURING METHOD OF MULTILAYER PRINTED CIRCUIT BOARD, LIQUID DROP DISCHARGE DEVICE, PROGRAM, AND STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of printed circuit board which can form an insulating layer and a conductive film at the upper part of the wiring for high-speed signal allocated at the area where wiring interval is narrow.

SOLUTION: The printed circuit board 30 includes a base material 46 having insulation property, a single or a plurality of vias 37 for electrically connecting predetermined wiring layers formed on the base material 46, and a signal wiring 36 electrically insulated from the vias 37. This printed circuit board manufacturing method comprises the step of forming an insulating layer to form an insulating layer 41 by discharging the insulating layer forming material using a liquid drop discharge device, on the basis of image data of the printed circuit board 30 forming at least via 37 and signal wiring 36; design data including at least via 37 and signal wiring 36; and the predetermined insulating layer forming position data 40 to form the insulating layer 41 covering the signal wiring 36, except for the region including the via 37.

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