| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-resolution thermosetting connection member for a circuit capable of retaining conductive particles by preventing them from easily flowing out from the surfaces of electrodes in connection, capable of easily providing contact between the electrodes and the conductive particles, hardly containing bubbles in a connection part, excelling in long-time connection reliability, excelling in work efficiency without needing correct positioning between the conductive particles and the electrodes, and useful for connection between the electrodes; to provide a connection structure of electrodes using it; and to provide a connection method. SOLUTION: This thermosetting connection member for a circuit is composed by forming an epoxy resin and a phenoxy resin as an insulating adhesion layer on at least one surface of a conductive adhesion layer comprising a conductive material, an epoxy resin and a phenoxy resin as a binder and having conductivity in a pressing direction, and is provided with an insulating adhesion layer having melt viscosity equivalent to that of the conductive adhesion layer. COPYRIGHT: (C)2007,JPO&INPIT
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