| 摘要 |
A laminating kit and method for using the kit to perform lamination without a specialized hot-roller lamination machine is disclosed. The kit comprises a resilient board such as foamboard, a folded, release-coated paper to sandwich the lamination project above the resilient board, and an optional liner board attached at the bottom of the resilient board for additional stiffness. Items to be laminated are sandwiched in plastic lamination sheets and inserted between the two ends of the folded, release-coated paper. An iron is then drawn across the kit with its face at an angle to the kit and the bottom edge of the face contacting the kit. Pressure from the iron causes a depression to form in the resilient board, thereby duplicating the effect of heated rollers in a typical commercial lamination machine and resulting in a smooth, bubble-free lamination project.
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