发明名称 |
FABRICATION OF SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS |
摘要 |
A semiconductor wafer includes a plurality of active circuit die areas, each of which being bordered by a dicing line region through which the plurality of active circuit die areas are separated from each other, wherein each of the plurality of active circuit die areas has substantially four corners. An overcoat is deposited to cover both the active circuit die areas and the dicing line region. A first trench is formed by etching through the overcoat and disposed merely around the four corners of each active circuit die area. A reinforcing second trench is etched into the overcoat and is disposed in proximity to the first trench. A die seal ring is disposed in between the active circuit chip area and the first trench.
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申请公布号 |
US2006278957(A1) |
申请公布日期 |
2006.12.14 |
申请号 |
US20050160106 |
申请日期 |
2005.06.09 |
申请人 |
LIN ZONG-HUEI;LIU HUNG-MIN;JAO JUI-MENG;CHANG WEN-TUNG;CHEN KUO-MING;HO KAI-KUANG |
发明人 |
LIN ZONG-HUEI;LIU HUNG-MIN;JAO JUI-MENG;CHANG WEN-TUNG;CHEN KUO-MING;HO KAI-KUANG |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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