发明名称 |
Mold, pattern forming method, and pattern forming apparatus |
摘要 |
A pattern forming method for forming a pattern includes: preparing a mold 104 provided with a first surface including a pattern area 1000 , a second surface located opposite from the first surface, and an alignment mark 2070 provided at a position at which the alignment mark 2070 is away from the second surface and is close to the first surface; contacting the pattern area 1000 of the mold 104 with the coating material disposed on a substrate 5000 ; obtaining information about positions of the mold 104 and the substrate 5000 by using the alignment mark 2070 and a mark 5300 provided to the substrate 5000 in a state in which the coating material is disposed on the substrate 5000 at a portion where the alignment mark 2070 and the substrate 5000 are opposite to each other; and effecting alignment of the substrate 5000 with the mold 104 with high accuracy on the basis of the information. |
申请公布号 |
US2006279004(A1) |
申请公布日期 |
2006.12.14 |
申请号 |
US20060448009 |
申请日期 |
2006.06.07 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
SUEHIRA NOBUHITO;SEKI JUNICHI;MAJIMA MASAO;TERASAKI ATSUNORI;INA HIDEKI |
分类号 |
H01L23/544;B29C33/30;B29C33/38;B29C59/02;B82B1/00;B82Y10/00;B82Y30/00;B82Y40/00;G03F7/20;H01L21/027 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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