发明名称 |
Halbleitermodul und Leistungswandlervorrichtung |
摘要 |
One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13. <IMAGE> |
申请公布号 |
DE60306040(T2) |
申请公布日期 |
2006.12.14 |
申请号 |
DE2003606040T |
申请日期 |
2003.07.03 |
申请人 |
HITACHI LTD.;HITACHI CAR ENGINEERING CO. LTD. |
发明人 |
YOSHIZAKI, ATSUHIRO;MASHINO;ANAN;OCHIAI |
分类号 |
H01L23/051;H01L23/367;H01L23/373;H01L25/07;H01L25/11;H02M7/48 |
主分类号 |
H01L23/051 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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