| 摘要 |
<p>An assembly for high performance cooling of electronics is described that includes a container for heat transfer liquid in which complex electronic assemblies are immersed. The electronics are sealed inside the liquid container such that an electrical connector protrudes to the exterior of the container. A thermally conductive plate is made part of the liquid filled container assembly such that a portion of the plate is in contact with the liquid and a portion of the plate protrudes from or forms part of the exterior of the container.</p> |
