| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip LED sealing a parallel connection of a plurality of LED elements in one package while preventing imbalance of current among the LED elements. <P>SOLUTION: In the chip LED mounting a plurality of LED elements on one small substrate, the LED elements are mounted on a common electrode of the small substrate using a die bond paste material having a resistance component in electrical connection between the lower surface electrode each of the plurality of LED elements and the common electrode of the small substrate, and wire bonding is used for connection between the upper surface electrode each of the plurality of LED elements and other common electrode of the small substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
