| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive excellent in a repairing property in addition to an adhesion property, heat-resistance and a low hydroscopic property and capable of suppressing increase of resistance in a cycle-resistance test, a film, a semiconductor part package and a production method for a semiconductor part package. SOLUTION: The adhesive comprises a binder resin and a curing agent for crosslinking the crosslinking constitution parts of the binder resin in a three-dimension. An attachment/detachment structure wherein crosslinking is formed through the curing agent by heating it to a first temperature or higher and the crosslinking by the curing agent is cleaved by heating it to a second temperature or higher that is higher than the first temperature is provided on at least a part of the crosslinking constitution parts. COPYRIGHT: (C)2007,JPO&INPIT
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