| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the substrate; and an adhesive for bonding the sealing structure and the substrate, wherein the sealing structure has a groove for storing the adhesive.
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| 申请公布号 |
US2006278946(A1) |
申请公布日期 |
2006.12.14 |
| 申请号 |
US20060422777 |
申请日期 |
2006.06.07 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SHIRAISHI SATOSHI;KAZAMA YOICHI |
| 分类号 |
H01L31/0203;H01L23/10;H01L27/14;H04N5/225 |
主分类号 |
H01L31/0203 |
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