| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem wherein the end face of an interposer wiring pattern on a package side face is exposed, with respect to narrowing of gaps between components. <P>SOLUTION: The end of the interposer board wiring pattern is positioned inside of package side face, to realize zero setting of gap between the package and chip components. <P>COPYRIGHT: (C)2007,JPO&INPIT |
