发明名称 PLATING LIQUID FOR DEPOSITING CONDUCTIVE FILM, CONDUCTIVE FILM, ITS MANUFACTURING METHOD, TRANSLUCENT ELECTROMAGNETIC WAVE SHIELD FILM, AND PLASMA DISPLAY PANEL
摘要 PROBLEM TO BE SOLVED: To provide a plating liquid for depositing a conductive film having excellent stability which is used for a manufacturing method of a conductive film by performing the pattern exposure, the development and the plating on a silver halide photosensitized material, a manufacturing method of a conductive film having high conductivity without irregularity using the plating liquid, and an electromagnetic wave shield film. SOLUTION: The plating liquid is used for a manufacturing method of a conductive film in which a metal silver part is plated after forming the metal silver part by performing the development on a silver halide photosensitized material. In the plating liquid for depositing the conductive film and the conductive film manufacturing method, the plating liquid contains at least one of polyamino-polycarboxylic acid or the like to be selected from general formulae (I), (II) and (III), or its aqueous soluble salt. The conductive film and the translucent electromagnetic wave shield film are formed by using the same. An image display device is equipped with these films. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006336090(A) 申请公布日期 2006.12.14
申请号 JP20050164469 申请日期 2005.06.03
申请人 FUJIFILM HOLDINGS CORP 发明人 NOMURA HIDEAKI
分类号 C23C18/18;C23C18/31;C23C18/40;G03C1/00;H01B5/14;H01B13/00;H05K3/18;H05K9/00 主分类号 C23C18/18
代理机构 代理人
主权项
地址